Automatic Laser Cutting Machine, Laser Drilling Machine, Laser Wafer Marking Equipment
THE COMPANY
Automatic Laser Cutting Machine, Laser Drilling Machine, Laser Wafer Marking Equipment
| Tipo de negocio | Manufacturer & Trading Company |
| Año de fundación | 2013 |
| Total de empleados | 182 |
| Capacidades | ODM,OEM,OBM,Sample |
| Términos comerciales | FOB,EXW,CIF |
| País | China |
| Dirección | Floor 1-2, Building B, Jingang Science Park, Qiaotou Community, Fuyong Street, Baoan District, Shenzhen, Guangdong, China |
INSIDE THE FACILITY — 5 PHOTOS
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